Today on the final day of PACK EXPO 2017, Emerson's Mike Mediana presented on the topic, Migrating from Traditional Package Sealing Technologies to Ultrasonics in Flexible Packaging Applications. Mike's presentation focused on how consumer preference is driving the...
We invite you to follow us on Facebook, LinkedIn, Twitter and YouTube to stay up to date on the latest news, events and innovations that will help you face and solve your toughest challenges.
Just post a link to the entry and send us a quick note so we can share your work. Thank you very much.
Our Global Community
Emerson Exchange 365
The opinions expressed here are the personal opinions of the authors. Content published here is not read or approved by Emerson before it is posted and does not necessarily represent the views and opinions of Emerson.